Semiconductor Engineering

What Will Replace Dual Damascene?

In the mid-1990s, IBM announced the world’s first devices using a copper dual damascene process. At the time, the dual damascene manufacturing process was hailed as a major breakthrough. The new ...
Semiconductor Engineering

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents ...
EDN

FSI joins copper dual damascene process alliance

MINNEAPOLIS–FSI International Inc. said it has signed a cooperative agreement with Novellus Systems Inc. to join the Damascus Alliance. The alliance is a group of semiconductor equipment companies ...
Business Wire

Shin-Etsu Chemical: Developing Equipment to Manufacture Semiconductor Package Substrates for the Back End Process and Pursuing a New Manufacturing Method

TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Machine Design

Chipmakers move to Second-Generation Copper

Improvements in the deposition of copper will usher in new ultralarge-scale ICs. Copper has become the material of choice for fabricating connections on ultralarge scale integrated circuits. The ...
EDN

Sematech Qualifies Porous Low K for Dual Damascene

International Sematech engineers have qualified a porous, ultra low-k material for dual damascene copper processing at 0.13-micron feature sizes using 193nm lithography on 300mm wafers, the consortium ...